TMK432C226MM-T [TAIYO YUDEN]
Ceramic Capacitor, Multilayer, Ceramic, 25V, 20% +Tol, 20% -Tol, X5S, 22% TC, 22uF, Surface Mount, 1812, CHIP;
| 型号： | TMK432C226MM-T |
| 厂家： | 
TAIYO YUDEN (U.S.A.), INC |
| 描述： | Ceramic Capacitor, Multilayer, Ceramic, 25V, 20% +Tol, 20% -Tol, X5S, 22% TC, 22uF, Surface Mount, 1812, CHIP 电容器 |
| 文件： | 总19页 (文件大小：1255K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
大容量積層セラミックコンデンサ
HIGH VALUE MULTILAYER CERAMIC
CAPACITORS
code Temp.characteristics operating Temp. range
B
K25VJ85C
K55VJ125C
K55VJ85C
K25VJ85C
X7R
X5R
C
X5S
X6S
E
Y5U
F
Y5V
BJ
C
K55VJ85C
K55VJ105C
K25VJ85C
K30VJ85C
K25VJ85C
K30VJ85C
OPERATING TEMP.
E
F
特長ꢀFEATURES
Y電極にNi金属を使用し、端子電極部にメッキをしてあることにより、はん
だ付け性および耐熱性にすぐれ、マイグレーションもほとんど発生せず、
YThe use of Nickel(Ni) as material for both the internal and external elec-
trodes improves the solderability and heat resistance characteristics. This
高い信 almost completely eliminates migration and raises the level of reliability
頼性を示します
Y等価直
列抵抗fESRgが小さく、ノイズ吸収性にすぐれています。特にタン
タルおよびアルミ電解コンデンサに比較した場合
Y高い許容リップル電流値
significantly.
YLow equivalent series resistance(ESR) provides excellent noise absorp-
tion characteristics.
Y高い定格電圧でありながら小型 形状
YCompared to tantalum or aluminum electrolytic capacitors these ceramic
Y絶縁抵抗、破壊電圧が高く信
頼性にすぐれる
capacitors offer a number of excellent features, including:
等の特徴があります
Higher permissible ripple current values
Smaller case sizes relative to rated voltage
Improved reliability due to higher insulation resistance and break-
down voltage.
用途ꢀAPPLICATIONS
Yデジタル回路全般
YGeneral digital circuit
YPower supply bypass capacitors
Y電源
液晶モジュール用 Liquid crystal modules
液晶駆動電圧ライン用 Liquid crystal drive voltage lines
電圧の高いLSI、IC、OPアンプ用
Y平滑コンデンサ
DC-DCコンバータf入力、出力側 用g
バイパスコンデンサ
電源
LS I, I C, converters(both for input and output)
YSmoothing capacitors
DC-DC converters (both for input and output)
スイッチング電源
f2次側 用g
Switching power supplies (secondary side)
形名表記法ꢀORDERING CODE
1
3
5
7
9
端子電極
K
温度特性 hLi
容量許容差
個
別仕様
K
定格電圧 hVDCi
J30
A
4
メッキ品
QF
QC
QE
B J
ꢀ
K80
K
M
Z
M10
M20
%
%
%
標準
J
L
6.3
10
M20
J20
J80
K20
20
K55
10
包装
4
E
T
G
U
16
25
35
50
M10
QW スペース
8
形状寸法 hEIAiLPWfmmg
B
T
単品 f 袋づめ g
リールテーピング
107f0603g
212f0805g
316f1206g
325f1210g
432f1812g
1.6P0.8
2.0P1.25
3.2P1.6
3.2P2.5
4.5P3.2
製品厚 み hmmi
6
K
V
A
D
F
G
H
L
0.45
0.5
0.8
0.85
1.15
1.25
1.5
公称静電容量 hpFi
例
11
2
当社管理記号
473
105
47,000
1,000,000
シリーズ名
Q
標準品
QW スペース
M
積層コンデンサ
1.6
N
Y
M
U
1.9
2.0max
2.5
3.2
_
J M K 3 1 6 B J 1 0 6 M L T Z
6
1
2
3
4
5
7
8
9
10
11
1
3
5
7
9
Special code
End termination
Temperature characteristics code
Capacitance tolerances
h
L
i
Rated voltagehVDCi
A
J
L
E
T
G
U
4
6.3
10
16
25
35
50
K
Plated
K30VJ85C
K
M
Z
M10
K
Standard products
QF
B J
B J
QC
QC
Y5V
X7R
X5R
X5S
X6S
J22NK82L
K55VJ125C
M15L
K55VJ85C
M15L
M20
J80
ꢀ
K20
10
Packaging
B
T
4
8
Dimensionshcase sizeifmmg
K55VJ85C
M22L
Bulk
Tape & reel
Thicknesshmmi
107f0603g
212f0805g
316f1206g
325f1210g
432f1812g
1.6P0.8
2.0P1.25
3.2P1.6
3.2P2.5
4.5P3.2
K
V
A
D
F
G
H
L
N
Y
M
U
0.45
0.5
0.8
0.85
1.15
1.25
1.5
1.6
1.9
K55VJ105C
M22L
K30VJ85C
M22NK56L
QWBlank space
11
QE Y5U
2
Internal code
Q
Standard products
Series name
M
6
Multilayer Ceramic Capacitors
QWBlank space
Nominal capacitancehpFi
example
473
105
2.0max
2.5
3.2
47,000
1,000,000
38
外形寸法ꢀEXTERNAL DIMENSIONS
TypefEIAg
L
W
T
0.45M0.05
e
K
V
A
K
D
G
D
F
f0.018M0.002g
0.50M0.05
f0.020M0.002g
0.8M0.10
f0.031M0.004g
0.45M0.05
f0.018M0.002g
0.85M0.10
f0.033M0.004g
*1
1.25M0.10
f0.049M0.004g
0.85M0.10
f0.033M0.004g
1.15M0.10
f0.045M0.004g
1.25M0.10
f0.049M0.004g
1.6M0.20
f0.063M0.008g
GMK107
(0603)
1.6M0.10
f0.063M0.004g
0.8M0.10
f0.031M0.004gꢀ�
0.35M0.25
f0.014M0.010g
GMK212
f0805g
2.0M0.10*1
f0.079M0.004g
1.25M0.10*1
f0.049M0.004g
0.5M0.25
f0.020M0.010g
J0.35
0.50000
K0.25
ꢀꢀ��g
0.020K0.010
GMK316
(1206)
3.2M0.15
f0.126M0.006g
1.6M0.15
f0.063M0.006g
J0.014
f
G
L
4
0.85M0.10
f0.033M0.004g
1.15M0.10
D
F
f0.045M0.004g
1.5M0.10
f0.059M0.004g
0.6M0.3
f0.024M0.012g
H
N
GMK325
(1210)
3.2M0.30
f0.126M0.012g
2.5M0.20*2
f0.098M0.008g
1.9M0.20
f0.075M0.008g
J0.1
1.9
K0.2
f0.075JK00..000084 g
Y
M
Y
*2
f0.098M0.008g
2.5M0.20
J0.1
K0.2
1.9
f0.075JK00..000084 g
注： ＊1. M0.15mm公差あり
＊2. M0.3mm公差あり
Note: ＊1. Inclulding dimension toleranceM0.15mm fM0.006inchg.
Note: ＊2. Inclulding dimension toleranceM0.3mm fM0.012inchg.
GMK432
(1812)
4.5M0.40
f0.177M0.016g
3.2M0.30
f0.126M0.012g
2.5M0.20
f0.098M0.008g
3.2M0.30
0.9M0.6
f0.035M0.024g
M
U
f0.125M0.012g
UnitDmm finchg
概略バリエーシ ョンꢀAVAILABLE CAPACITANCE RANGE
Cap Type
TC B/X7R
107
212
B/X5R
316
B/X5R
325
432
C/X5S C/X6S F/Y5V
B/X5R
X5R C/X5S
F/Y5V
B/X7R
X5R
F/Y5V
B/X7R
X5R C/X5S
F/Y5V
B/X7R
B/X5R
X5R E/Y5U
F/Y5V
B/X5R
VDC
AF 3[digits]
0.022 223
0.033 333
0.047 473
0.068 683
0.1 104
0.15 154
0.22 224
0.33 334
0.47 474
0.68 684
25 16 10 50 35 25 16 10 6.3 6.3
4
25 50 25 16 10 50 35 25 16 10 50 35 25 16 10 6.3 6.3 50 16 10 6.3 50 35 25 16 10 6.3 25 16 10 6.3 6.3
4
25 50 35 25 16 10 50 25 16 10 35 25 16 10 6.3 6.3
4
6.3 50 35 16 10 6.3 25 16 10 6.3 50 25 6.3 6.3 10 6.3
A
A
A
A
A
A
A
G
G
A
A
A
A
A
A
A
A
G
G
A
A
A A
A A
A
F
L
A
G
F
F
G
A A
G G
G
G
L
G
G G G
L
L
L
L
F
F
1
105
A A
A
A A
A
A A
A A
G G
H
1.5 155
2.2 225
3.3 335
4.7 475
6.8 685
10 106
22 226
47 476
100 107
220 227
A A
G
G G G
G
G
L
L
L
G
H
N
N
A
A
L
L
L
L
L
L
G G G
G
G
L
N
N N
H
F
L.F
L
A
G G G
G G
L
L
L
L
L
L
L
L
L
L
F
L
M
N
M.N
N
H
F
M
M
G
M M
N
N.F
M M
M
M
L
L
M M
N
M
M
U
M
M Y M
M
M
U
■低 積層セラミックコンデンサꢀLow profile Multilayer Ceramic Capacitors
Cap
Type
TC
107
X5R
6.3
212
B/X5R
316
B/X5R
325
B/X5R
10
432
E/Y5U C/X5S
6.3 6.3
B/X5R
10 6.3
F/Y5V
6.3
B/X7R
X5R
F/Y5V
10
B/X7R
10
F/Y5V
10 6.3
B/X7R
25
VDC
3[digits]
223
333
473
683
104
154
224
334
474
684
105
155
225
335
475
685
106
226
476
826
107
50
25
16
10
25
16
10
6.3
10
6.3
50
6.3
25
16
10
6.3
16
6.3
4
AF
0.022
0.033
0.047
0.068
0.100
0.150
0.220
0.330
0.470
0.680
1.000
1.500
2.200
3.300
4.700
6.800
10.000
22.000
47.000
82.000
100.000
D
D
D
D
D
D
K
D
K
K
D
D
D
D
K
K
D
D
D
D
K
D
D
K
D
D
D
D
D
V
V
D
D
D
D
D
K
D
D
D
D
Y
D
D
D
D
D
D
N
Y
温度特性�
温度特性コード�
Temperature characteristics
静電容量許容差h�Li
tandhLi
Temp. char.Code
準拠規格�
Applicable standard
温度範囲�hCi
準温度h�Ci
Capacitance tolerance
Dissipation factor
静電容量変化率h�Li
Temperature range
Ref. Temp.
20
25
Capacitance change
JIS
EIA
JIS
EIA
EIA
JIS
EIA
JIS
EIA
B
X7R*
C
X5S
X6S
E
Y5U
F
Y5V
K25V85
M10
M15
M20
M22
M22
BJ
C
2.5%max.**
K55V125
K25V85
K55V85
K55V105
K25V85
K30V85
M20fMg
M10fKg
20
25
25
20
25
20
25
7.0%max.**
7.0%max.**
N
J20 K55
E
F
N
J22 K56
J80
fZg
K20
N
K25V85
K30V85
J30 K80
N
J22 K82
**： X5Rのみ対応するアイテムがあります。詳細
はアイテム一覧を参照ください。
**： 代表的な値 を記載しています。詳細はアイテム一覧表を参照ください。
**： Some of the parts are only applicable to X5R. Please refer to PART NUMBERS table.
**： The figure indicates typical value. Please refer to PART NUMBERS table.
セレクションガイド
Selection Guide
アイテム一覧
Part Numbers
特性図
Electrical Characteristics
梱包
Packaging
信
頼性
使用上の注意
Reliability Data
Precautions
P.10
etc
P.40
P.44
P.78
P.80
P.86
39
■汎用・低背積層セラミックコンデンサꢀGeneral・Low profile Multilayer Ceramic Capacitors
アイテム一覧 PART NUMBERS
F107TYPE (0603 case size)
静電容量�
許容差�
公ꢀꢀ称�
静電容量�
Capacitance
[AF]
実装条件�
tanδ�
厚
ꢀꢀみ�
温度特性�
Temperature
定ꢀ格�
電ꢀ圧�
形ꢀꢀ名�
Soldering method
R:リフロー�Reflow soldering
W:フロー�Wave soldering
Thickness
[mm]
Dissipation
factor
[L]Max.
Capacitance
tolerance
characteristics
RatedVoltage
Ordering code
0.8M0.1
0.8M0.1
0.8M0.1
0.8M0.1
0.8M0.1
0.8M0.1
0.8M0.1
0.8M0.1
0.8M0.1
0.8M0.1
0.8M0.1
0.8M0.1
0.8M0.1
0.8M0.1
0.8M0.1
0.8M0.1
0.8M0.1
0.8M0.1
0.8M0.1
0.8M0.1
0.45M0.05
0.8M0.1
0.8M0.1
0.8M0.1
0.8M0.1
0.8M0.1
0.5M0.05
0.45M0.05
0.45M0.05
0.8M0.1
0.8M0.1
0.8M0.1
0.8M0.1
0.5M0.05
0.8M0.1
0.8M0.1
0.8M0.1
0.8M0.1
0.8M0.1
0.8M0.1
0.8M0.1
0.8M0.1
0.8M0.1
0.45M0.05
50V
35V
UMK107 BJ 104GꢀA*
GMK107 BJ 333GA
GMK107 BJ 473GA
TMK107 BJ 223GA
TMK107 BJ 683GA
TMK107 BJ 104GA
TMK107 BJ 154GA
TMK107 BJ 224GA
TMK107 BJ 334GA
TMK107 BJ 474GA*
TMK107 BJ 105GA*
EMK107 BJ 333GA
EMK107 BJ 473GA
EMK107 BJ 683GA
EMK107 BJ 104GA
EMK107 BJ 154GA
EMK107 BJ 224GA
EMK107 BJ 474GA
EMK107 BJ 105GA*
EMK107 BJ 105GA*
LMK107 BJ 105GK*
LMK107 BJ 334GA
LMK107 BJ 474GA
LMK107 BJ 684GA
LMK107 BJ 105GA*
LMK107 BJ 225GA*
JMK107 BJ 225GV*
JMK107 BJ 474GK
JMK107 BJ 105GK*
JMK107 BJ 225GA*
JMK107 BJ 335GA*
JMK107 BJ 475MA*
AMK107 BJ 106MA*
AMK107 BJ 225GV*
UMK107 C105GA*
UMK107 F104 Z A
TMK107 F474 Z A
EMK107 F224 Z A
EMK107 F474 Z A
EMK107 F105 Z A
EMK107 F225 Z A
LMK107 F105 Z A
LMK107 F225 Z A
JMK107 F105 Z K
0.1
0.033
0.047
0.022
0.068
0.1
0.15
0.22
0.33
0.47
1
0.033
0.047
0.068
0.1
0.15
0.22
0.47
1
1
1
0.33
0.47
0.68
1
2.2
2.2
0.47
1
2.2
B/X5R
B/X5R
B/X5R
B/X7R
B/X5R
B/X5R
B/X5R
B/X5R
B/X5R
B/X5R
B/X5R
B/X7R
B/X7R
B/X7R
B/X7R
B/X5R
B/X5R
B/X5R
B/X7RF
B/X5R
B/X5R
B/X5R
B/X5R
B/X5R
B/X7R
B/X5R
X5R
3.5
2.5
2.5
2.5
3.5
3.5
3.5
3.5
3.5
3.5
5
3.5
3.5
3.5
3.5
3.5
3.5
3.5
5
R/W
25V
R
R/W
M10L
M20L
16V
10V
R
5
10
3.5
3.5
5
R/W
5
10
10
5
B/X5R
B/X5R
B/X5R
X5R
X5R
X5R
10
10
10
10
10
10
10
7
7
7
7
16
16
16
16
16
R
6.3V
4V
3.3
4.7
10
2.2
1
0.1
0.47
0.22
0.47
1
M20L
M10L
M20L
X5R
C/X5S
F/Y5V
F/Y5V
F/Y5V
F/Y5V
F/Y5V
F/Y5V
F/Y5V
F/Y5V
F/Y5V
50V
25V
R/W
R
16V
J80L
K20L
2.2
1
2.2
1
10V
6.3V
形名のGには静電容量許容差記号が入ります。 G Please specify the capacitance tolerance code.
*高温負荷試験の試験電圧は定格電圧の1.5倍
F品名末尾にRが付きます。
* Test Voltage of Loading at high temperature test is 1.5 time of the rated voltage.
F Internal code shall be R.
**高温負荷試験の試験電圧は定格電圧の1.3倍
** Test Voltage of Loading at high temperature test is 1.3 time of the rated voltage.
40
アイテム一覧
PART NUMBERS
F212TYPE (0603 case size)
静電容量�
許容差�
公ꢀꢀ称�
静電容量�
Capacitance
[AF]
実装条件�
tanδ�
厚
ꢀꢀみ�
温度特性�
Temperature
定ꢀ格�
電ꢀ圧�
形ꢀꢀ名�
Soldering method
R:リフロー�Reflow soldering
W:フロー�Wave soldering
Thickness
[mm]
Dissipation
factor
[L]Max.
Capacitance
tolerance
characteristics
RatedVoltage
Ordering code
0.85M0.1
0.85M0.1
1.25M0.1
1.25M0.1
1.25M0.1
1.25M0.1
1.25M0.1
1.25M0.1
1.25M0.1
1.25M0.1
0.85M0.1
0.85M0.1
0.85M0.1
0.85M0.1
1.25M0.1
1.25M0.1
1.25M0.1
0.85M0.1
0.85M0.1
0.85M0.1
0.85M0.1
0.85M0.1
1.25M0.1
1.25M0.1
1.25M0.1
1.25M0.15
1.25M0.15
0.45M0.05
0.45M0.05
0.85M0.1
0.85M0.1
0.85M0.1
0.85M0.1
1.25M0.1
1.25M0.1
1.25M0.1
1.25M0.15
1.25M0.15
0.45M0.05
0.45M0.05
0.85M0.1
0.85M0.1
1.25M0.15
1.25M0.15
1.25M0.15
0.85M0.1
1.25M0.1
1.25M0.1
1.25M0.1
0.85M0.1
1.25M0.1
1.25M0.1
0.85M0.1
1.25M0.1
UMK212 BJ2 23GD
UMK212 BJ3 33GD
UMK212 BJ4 73GG
UMK212 BJ6 83GG
UMK212 BJ1 04GG
UMK212 BJ1 54GG
UMK212 BJ2 24GG
UMK212 BJ4 74GG*
GMK212 BJ3 34GG
GMK212 BJ4 74GG
TMK212 BJ4 73GD
TMK212 BJ6 83GD
TMK212 BJ4 74GD
TMK212 BJ1 05GD*
TMK212 BJ1 05GG*
TMK212 BJ1 05GG
TMK212 BJ2 25GG*
EMK212 BJ4 74GD
EMK212 BJ6 84GD
EMK212 BJ1 05GD
EMK212 BJ1 55GD
EMK212 BJ2 25GD
EMK212 BJ6 84GG
EMK212 BJ1 05GG
EMK212 BJ2 25GG
EMK212 BJ4 75GG*
EMK212 BJ1 06GG*
LMK212 BJ2 24GK
LMK212 BJ1 05GK
LMK212 BJ1 05GD
LMK212 BJ2 25GD*
LMK212 BJ4 75GD*
LMK212 BJ1 06GD*
LMK212 BJ1 05GG
LMK212 BJ2 25GG
LMK212 BJ3 35GG
LMK212 BJ4 75GG*
LMK212 BJ1 06GG*
JMK212 BJ1 05GK
JMK212 BJ4 75GK*
JMK212 BJ4 75GD*
JMK212 BJ1 06GD*
JMK212 BJ4 75GG
JMK212 BJ1 06GG*
JMK212 BJ2 26MG*
UMK212 F2 24 Z D
UMK212 F4 74 ZG
UMK212 F1 05 ZG
EMK212 F2 25 ZG
LMK212 F2 25 Z D
LMK212 F4 75 ZG
LMK212 F1 06 ZG
JMK212 F4 75 Z D
JMK212 F1 06 ZG
0.022
0.033
0.047
0.068
0.1
0.15
0.22
0.47
0.33
0.47
0.047
0.068
0.47
1
B/X7R
B/X7R
B/X7R
B/X7R
B/X7R
B/X7R
B/X5R
B/X5R
B/X7R
B/X5R
B/X7R
B/X7R
B/X5R
B/X5R
B/X7RF
B/X5R
B/X5R
B/X7R
B/X7R
B/X5R
B/X5R
B/X5R
B/X7R
B/X7R
B/X5R
B/X5R
B/X5R
B/X5R
B/X5R
B/X7R
B/X5R
B/X5R
X5R
B/X7R
B/X7R
B/X5R
B/X5R
B/X5R
B/X5R
X5R
B/X5R
X5R
B/X5R
B/X5R
X5R
F/Y5V
F/Y5V
F/Y5V
F/Y5V
F/Y5V
F/Y5V
F/Y5V
F/Y5V
F/Y5V
2.5
2.5
2.5
2.5
2.5
3.5
3.5
3.5
3.5
3.5
2.5
2.5
3.5
5
5
5
5
3.5
3.5
5
5
5
4
50V
R/W
35V
25V
1
1
R
2.2
0.47
0.68
1
1.5
2.2
0.68
1
2.2
4.7
10
0.22
1
R/W
R
M10L
M20L
16V
3.5
3.5
5
R/W
5
10
3.5
5
3.5
5
10
10
3.5
5
R
1
2.2
4.7
10
10V
1
R/W
2.2
3.3
4.7
10
5
5
10
5
10
10
10
5
10
10
7
7
7
7
9
1
4.7
4.7
10
4.7
10
R
6.3V
22
M20L
0.22
0.47
1
2.2
2.2
4.7
10
50V
16V
10V
R/W
R
J80L
K20L
9
16
16
16
4.7
10
6.3V
形名のGには静電容量許容差記号が入ります。 G Please specify the capacitance tolerance code.
*高温負荷試験の試験電圧は定格電圧の1.5倍
F品名末尾にRが付きます。
* Test Voltage of Loading at high temperature test is 1.5 time of the rated voltage.
F Internal code shall be R.
**高温負荷試験の試験電圧は定格電圧の1.3倍
41
アイテム一覧 PART NUMBERS
F316TYPE (0603 case size)
静電容量�
許容差�
公ꢀꢀ称�
静電容量�
Capacitance
[AF]
実装条件�
tanδ�
厚
ꢀꢀみ�
温度特性�
Temperature
定ꢀ格�
電ꢀ圧�
形ꢀꢀ名�
Soldering method
R:リフロー�Reflow soldering
W:フロー�Wave soldering
Thickness
[mm]
Dissipation
factor
[L]Max.
Capacitance
tolerance
characteristics
RatedVoltage
Ordering code
1.15M0.1
1.6M0.2
1.6M0.2
1.6M0.2
1.6M0.2
0.85M0.1
1.15M0.1
1.15M0.1
1.6M0.2
0.85M0.1
1.6M0.2
1.6M0.2
1.6M0.2
1.6M0.2
0.85M0.1
0.85M0.1
1.15M0.1
1.15M0.1
1.6M0.2
1.6M0.2
1.6M0.2
1.6M0.2
1.6M0.2
0.85M0.1
0.85M0.1
0.85M0.1
1.6M0.2
1.6M0.2
1.6M0.2
1.6M0.2
1.6M0.2
1.15M0.1
1.15M0.1
0.85M0.1
1.6M0.2
1.6M0.2
1.6M0.2
1.6M0.2
1.6M0.2
1.6M0.2
1.25M0.1
1.25M0.1
1.6M0.2
1.6M0.2
1.6M0.2
0.85M0.1
1.15M0.1
1.6M0.2
0.85M0.1
UMK316 BJ 154GF
UMK316 BJ 224GL
UMK316 BJ 474GL
GMK316 BJ 684GL
GMK316 BJ 105GL
TMK316 BJ 154GD
TMK316 BJ 224GF
TMK316 BJ 334GF
TMK316 BJ 684GL
TMK316 BJ 105GD
TMK316 BJ 225GL
TMK316 BJ 335GL
TMK316 BJ 475GL*
TMK316 BJ 106GL*
EMK316 BJ 155GD
EMK316 BJ 225GD
EMK316 BJ 684GF
EMK316 BJ 105GF
EMK316 BJ 225GL
EMK316 BJ 335GL
EMK316 BJ 475GL*
EMK316 BJ 475GL
EMK316 BJ 106GL*
LMK316 BJ 335GD
LMK316 BJ 475GD
LMK316 BJ 106GD*
LMK316 BJ 335GꢀL
LMK316 BJ 475GL
LMK316 BJ 106GL*
LMK316 BJ 106GL*
LMK316 BJ 226ML*
JMK316 BJ 685GF
JMK316 BJ 106GF
JMK316 BJ 106GD*
JMK316 BJ 106GL
JMK316 BJ 226ML*
JMK316 BJ 226ML*
JMK316 BJ 476ML*
AMK316 BJ 476ML*
TMK316 C106GꢀL
UMK316 F225ZG
GMK316 F475ZG
GMK316 F106Z L
TMK316 F106Z L
EMK316 F106Z L
LMK316 F475Z D
LMK316 F106Z F
LMK316 F226Z L
JMK316 F106Z D
0.15
0.22
0.47
0.68
1
0.15
0.22
0.33
0.68
1
2.2
3.3
4.7
10
1.5
2.2
0.68
1
2.2
3.3
4.7
4.7
10
3.3
4.7
10
3.3
4.7
10
10
22
6.8
10
10
10
22
22
47
47
10
2.2
4.7
10
10
10
B/X7R
B/X7R
B/X7R
B/X7R
B/X7R
B/X7R
B/X7R
B/X7R
B/X7R
B/X5R
B/X7R
B/X5R
B/X5R
B/X5R
B/X5R
B/X5R
B/X7R
B/X7R
B/X7R
B/X7R
B/X7RF
B/X5R
B/X5R
B/X5R
B/X5R
B/X5R
B/X7R
B/X7R
B/X7RF
B/X5R
B/X5R
B/X5R
B/X5R
B/X5R
B/X7R
B/X7RF
B/X5R
X5R
2.5
2.5
3.5
3.5
3.5
2.5
2.5
2.5
3.5
3.5
3.5
3.5
5
50V
35V
R/W
25V
R
5
M10L
M20L
3.5
3.5
3.5
3.5
3.5
3.5
5
5
5
5
5
10
3.5
5
5
5
10
10
5
10
5
10
10
10
10
10
7
R/W
16V
10V
R
M20L
M10L
M20L
6.3V
M20L
4V
25V
50V
X5R
M10L M20L
C/X5S
F/Y5V
F/Y5V
F/Y5V
F/Y5V
F/Y5V
F/Y5V
F/Y5V
F/Y5V
F/Y5V
R/W
R
7
9
9
9
9
9
16
16
35V
25V
16V
J80L
K20L
4.7
10
22
10V
6.3V
10
形名のGには静電容量許容差記号が入ります。 G Please specify the capacitance tolerance code.
*高温負荷試験の試験電圧は定格電圧の1.5倍
F品名末尾にRが付きます。
* Test Voltage of Loading at high temperature test is 1.5 time of the rated voltage.
F Internal code shall be R.
**高温負荷試験の試験電圧は定格電圧の1.3倍
42
アイテム一覧 PART NUMBERS
F325TYPE (0603 case size)
静電容量�
許容差�
公ꢀꢀ称�
静電容量�
Capacitance
[AF]
実装条件�
tanδ�
厚
ꢀꢀみ�
温度特性�
Temperature
定ꢀ格�
電ꢀ圧�
形ꢀꢀ名�
Soldering method
R:リフロー�Reflow soldering
W:フロー�Wave soldering
Thickness
[mm]
Dissipation
factor
[L]Max.
Capacitance
tolerance
characteristics
RatedVoltage
Ordering code
1.5M0.1
1.9M0.2
0.85M0.1
1.5M0.1
1.9M0.2
1.9M0.2
1.9M0.2
2.5M0.2
2.5M0.2
1.9M0.2
0.85M0.1
1.9M0.2
2.5M0.2
0.85M0.1
1.9M0.2
0.85M0.1
0.85M0.1
1.9J0.1NK0.2
2.5M0.2
2.5M0.2
0.85M0.1
1.9J0.1NK0.2
1.9M0.2
2.5M0.2
2.5M0.3
1.9M0.2
2.5M0.2
1.5M0.1
1.5M0.1
1.9M0.2
1.15M0.1
1.9M0.2
1.9M0.2
2.5M0.2
UMK325 BJ 105GH
GMK325 BJ 225MN
TMK325 BJ 105MD
TMK325 BJ 225MH
TMK325 BJ 335MN
TMK325 BJ 475MN
TMK325 BJ 106MN*
TMK325 BJ 106MM*
TMK325 BJ 106MM*
EMK325 BJ 475MN
EMK325 BJ 106MD*
EMK325 BJ 106MN
EMK325 BJ 226MM*
LMK325 BJ 335MD
LMK325 BJ 106MN
LMK325 BJ 475MD
LMK325 BJ 106MD*
LMK325 BJ 226MY*
LMK325 BJ 226MM*
LMK325 BJ 476MM*
J MK325 BJ 685MD
J MK325 BJ 226MY
J MK325 BJ 826MN*
J MK325 BJ 476MM*
J MK325 BJ 107MM*
J MK325 E826 Z N*
J MK325 E107 ZM*
UMK325 F475 Z H
GMK325 F106 Z H
EMK325 F226 Z N
LMK325 F106 Z F
LMK325 F226 Z N
J MK325 F476 Z N
J MK325 F107 ZM*
1
2.2
1
B/X7R
B/X5R
B/X7R
B/X7R
B/X7R
B/X5R
B/X5R
B/X7RF
B/X5R
B/X7R
B/X5R
B/X5R
B/X5R
B/X5R
B/X7R
B/X5R
B/X5R
B/X5R
B/X5R
B/X5R
B/X5R
B/X5R
X5R
3.5
3.5
3.5
3.5
3.5
3.5
5
5
5
3.5
5
3.5
5
3.5
3.5
5
5
5
5
10
5
M10LM20L
R/W
50V
35V
4
2.2
3.3
4.7
10
10
10
4.7
10
10
22
3.3
10
4.7
10
22
22
47
6.8
22
82
47
100
82
100
4.7
10
22
10
22
47
100
25V
16V
10V
M20L
R
5
10
10
10
16
16
7
B/X5R
X5R
6.3V
E/Y5U
E/Y5U
F/Y5V
F/Y5V
F/Y5V
F/Y5V
F/Y5V
F/Y5V
F/Y5V
50V
35V
16V
7
J80L
K20L
16
16
16
16
16
10V
6.3V
F432TYPE (0603 case size)
静電容量�
許容差�
公ꢀꢀ称�
静電容量�
Capacitance
[AF]
実装条件�
tanδ�
厚
ꢀꢀみ�
温度特性�
Temperature
定ꢀ格�
電ꢀ圧�
形ꢀꢀ名�
Soldering method
R:リフロー�Reflow soldering
W:フロー�Wave soldering
Thickness
[mm]
Dissipation
factor
[L]Max.
Capacitance
tolerance
characteristics
RatedVoltage
Ordering code
2.5M0.2
2.5M0.2
2.5M0.2
2.5M0.2
3.2M0.3
2.5M0.2
2.5M0.2
2.5M0.2
3.2M0.3
TMK432 BJ 106MM
EMK432 BJ 226MM*
LMK432 BJ 226MM
J MK432 BJ 476MM*
J MK432 BJ 107MU*
UMK432 C106MM*
TMK432 C226MM*
TMK432 C476MM*
J MK432 C227MU*
J MK432 C107MM*
J MK432 C107MY*
LMK432 F476ZM*
J MK432 F107ZM*
10
22
22
47
100
10
22
47
220
100
100
47
B/X5R
B/X5R
B/X5R
B/X5R
B/X5R
C/X5S
C/X5S
C/X5S
C/X5S
C/X6S
C/X5S
F/Y5V
F/Y5V
3.5
3.5
3.5
5
10
5
25V
16V
10V
6.3V
50V
25V
M20L
5
5
R
15
7
10
16
16
2.5M0.2
6.3V
1.9J0.1NK0.2
2.5M0.2
J80L
K20L
10V
6.3V
2.5M0.2
100
形名のGには静電容量許容差記号が入ります。 G Please specify the capacitance tolerance code.
*高温負荷試験の試験電圧は定格電圧の1.5倍
F品名末尾にRが付きます。
* Test Voltage of Loading at high temperature test is 1.5 time of the rated voltage.
F Internal code shall be R.
**高温負荷試験の試験電圧は定格電圧の1.3倍
43
特性図ꢀELECTRICAL CHARACTERISTICS
インピーダンスYESR–周 波数特性例 Example of Impedance ESR vs. Frequency characteristics
Y当社積層セラミックコンデンサ例 (Taiyo Yuden multilayer ceramic capacitor)
LMK107F105Z
JMK107F225Z
LMK212F475Z
LMK316F106Z
LMK316F226Z
LMK432F476Z
JMK432F107Z
JMK325E107Z
44
特性図ꢀELECTRICAL CHARACTERISTICS
LMK212BJ105K
LMK212BJ225M
4
JMK212BJ106M
LMK432BJ226M
TMK107 C105M
JMK432C107M
TMK316 C106M
45
梱包ꢀPACKAGING
1最小受注単位数 Minimum Quantity
F袋づめ梱包�Bulk packagingꢀ�
2テーピング材質ꢀTaping material
製品厚 み�
Thickness
標準数量�
形式f�EIAg
Type
Standard
quantity
mmfinchg
code
[pcs]
0.5
f0.020g
GMK105f0402g
GVK105f0402g
GMK107f0603g
V, W
W
A
Z
0.8
f0.031g
0.8
f0.031g
0.6
f0.024g
0.85
f0.033g
1.25
f0.049g
0.85
f0.033g
0.85
f0.033g
0.85
f0.033g
1.15
f0.045g
1.25
f0.049g
1.6
f0.063g
0.85
f0.033g
1.15
f0.045g
1.5
f0.059g
1.9
A
B
D
G
D
D
D
F
G2K110f0504g
GMK212f0805g
G4K212f0805g
G2K212f0805g
1000
GMK316f1206g
G
L
D
F
H
N
GMK325f1210g
f0.075g
2.0max
f0.079g
Y
2.5
f0.098g
M
Fテーピング梱包ꢀT�aped packagingꢀ�
標準数量�
Standard quantity
[pcs]
製品厚 み�
Thickness
形式�fEIAg
Type
紙テープ� エンボステープ�
code
mmfinchg
paper
Embossed tape
0.3
f0.012g
GMK063f0201g
P
E
15000
GMK105f0402g
GVK105f0402g
V, W
W
0.5
f0.020g
E
10000
0.5
f0.020g
0.45
f0.018g
0.8
f0.031g
0.8
f0.031g
0.6
f0.024g
0.45
f0.018g
0.85
f0.033g
1.25
f0.049g
0.85
f0.033g
0.85
f0.033g
0.85
f0.033g
1.15
f0.045g
1.25
f0.049g
1.6
f0.063g
0.85
f0.033g
1.15
f0.045g
1.5
E
E
V
4000
4000
4000
4000
4000
4000
4000
E
GMK107f0603g
G2K110f0504g
K
A
Z
E
E
A
E
B
K
D
G
D
D
D
F
3バルクカセットꢀBulk Cassette
E
E
GMK212f0805g
3000
E
G4K212f0805g
G2K212f0805g
4000
4000
4000
E
E
GMK316f1206g
G4K316f1206g
3000
2000
E
E
G
L
D
F
2000
E
H
N
f0.059g
1.9
f0.075g
2.0max
f0.079g
2.5
GMK325f1210g
GMK432f1812g
Y
2000
E
M
500
E
E
E
f0.098g
UnitDmm finchg
1.9 f0.075g
2.5 f0.098g
3.2 f0.125g
1000
Y
M
U
105, 107, 212形状で個 別対応致しますのでお問い合せ下さい。
Please contact any of our offices for accepting your requirement according
to dimensions 0402, 0603, 0805.(inch)
500
78
梱包ꢀPACKAGING
3テーピング寸法ꢀTaping dimensionsꢀ
エンボステープꢀEmbossed tape（12mm幅）f0.472inches wideg
ꢀ紙テープꢀPaper Tape（8mm幅）f0.315inches widegꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀ
4
Type
Type
チップ挿入部
Chip Cavity
B
挿入ピッチ テープ厚
み
チップ挿入部
挿入ピッチ テープ厚 み
fEIAg
Insertion Pitch Tape Thickness
fEIAg
Chip cavity
Insertion Pitch Tape Thickness
A
F
T
A
B
F
K
T
0.37M0.065 0.67M0.065 52.0M0.05
f0.06M0.002g f0.027M0.002g f0.079M0.002g
0.45max.
0.018max.g
0.8max.
GMK063f0201g
f
3.7M0.2
4.9M0.2
8.0M0.1
4.0max. 0.6max.
GMK432f1812g
GMK105f0402g 0.65M0.15
1.15M0.15 52.0M0.05
f0.146M0.008g
f0.193M0.008g
f0.315M0.004g
f0.157max.g f0.024max.g
GVK105f0402g f0.026M0.004g f0.045M0.004g f0.079M0.002g
f0.031max.g
1.0M0.2
1.8M0.2
4.0M0.1
1.1max.
f0.043max.g
1.0max.
UnitDmmfinchg
GMK107f0603g
G2K110f0504g
f0.039M0.008g f0.071M0.008g f0.157M0.004g
1.15M0.2
1.55M0.2
4.0M0.1
f0.045M0.008g f0.061M0.008g f0.157M0.004g
f0.039max.g
4リーダー部／空部ꢀLeader and Blank portionꢀ
GMK212f0805g
1.65M0.25
2.4M0.2
G4K212f0805g
G2K212f0805g
f0.065M0.008g f0.094M0.008g
4.0M0.1
1.1max.
f0.157M0.004g
f0.043max.g
2.0M0.2
3.6M0.2
GMK316f1206g
f0.079M0.008g f0.142M0.008g
UnitDmmfinchg
ꢀエンボステープꢀEmbossed tape（8mm幅）f0.315inches wideg
160mm以上
100mm以上
f
6.3inches or more
g
f3.94inches or moreg
引き出し方向
Direction of tape feed
400mm以上
f15.7inches or moreg
5リール寸法ꢀReel sizeꢀ
Type
チップ挿入部
挿入ピッチ テープ厚 み
fEIAg
Chip cavity
Insertion Pitch Tape Thickness
A
B
F
K
T
1.65M0.25
2.4M0.2
GMK212f0805g
f0.065M0.008g f0.094M0.008g
GMK316f1206g
G4K316f1206g
2.0M0.2
3.6M0.2
4.0M0.1 2.5max. 0.6max
f0.079M0.008g f0.142M0.008g f0.157M0.004g f0.098max.g f0.024max.g
6トップテープ強度ꢀTop Tape Strengthꢀ
2.8M0.2
3.6M0.2
3.4max.
GMK325f1210g
f0.110M0.008g f0.142M0.008g
f0.134max.g
トップテープのはがし力は下図矢印方向にて0.1～0.7Nとなります。
The top tape requires a peel-off force of 0.1V0.7N in the direction of the
arrow as illustrated below.
UnitDmmfinchg
79
1/3
RELIABILITY DATA
Multilayer Ceramic Capacitor Chips
Specified Value
Temperature Compensating (Class 1)
Item
High Permitivity (Class 2)
Test Methods and Remarks
Standard
High Frequency Type
Standard Note1
BDK55 to J125C
High Value
High Capacitance Type BJfX7RgDK55～J125C, BJfX5RgDK55～J85C
1.Operating Temperature K55 to J125C
K25 to J85C
CfX5SgDK55～J85C,
EfY5UgDK30～J85C,
High Capacitance Type BJfX7RgDK55～J125C, BJfX5RgDK55～J85C
CfX6SgDK55～J105C
FfY5VgDK30～J85C
Range
FDK25 to J85C
BDK55 to J125C
FDK25 to J85C
50VDC,25VDC
2.Storage Temperature K55 to J125C
K25 to J85C
CfX5SgDK55～J85C,
EfY5UgDK30～J85C,
CfX6SgDK55～J105C
FfY5VgDK30～J85C
4
Range
3.Rated Voltage
50VDC,25VDC,
16VDC
16VDC
50VDC
50VDC,35VDC,25VDC
16VDC,10VDC,6.3VDC
4DVC
4.Withstanding Voltage
Between terminals
No breakdown or dam- No abnormality
age
No breakdown or damage
Applied voltage: Rated voltageP3 (Class 1)
Rated voltageP2.5 (Class 2)
Duration: 1 to 5 sec.
Charge/discharge current: 50mA max. (Class 1,2)
5.Insulation Resistance
10000 ME min.
500 MEAF. or 10000 ME., whichever is the Applied voltage: Rated voltage
smaller.
Note 5
Duration: 60M5 sec.
Charge/discharge current: 50mA max.
Measuring frequencyD
6.Capacitance (Tolerance)
0.5 to 5 pF: M0.25 pF
1 to 10pF: M0.5 pF
5 to 10 pF: M1 pF
11 pF or over: M 5%
M10%
0.5 to 2 pF : M0.1 pF
2.2 to 5.1 pF : M5%
B: M10%, M20%
J80
BDM10L、M20L
CDM10L、M20L
EDK20LNJ80L
FDK20LNJ80L
Class1D 1ＭHzM10%fCT1000pFg
1ｋHzM10%fCX1000pFg
Class2D 1ｋHzM10%fCT22 Fg
FD
%
K20
A
120HzM10HzfCX22 Fg
A
Measuring voltageD
Class1D0.5V5VrmsfCT1000pFg
1M0.2VrmsfCX1000pFg
105TYPERQ, SQ, TQ, UQ only
0.5～2pF: M0.1pF
Class2D 1M0.2VrmsfCT22 Fg
A
0.5M0.1VrmsfCX22 Fg
A
2.2～20pF: M5%
Bias application: None
7.Q or Tangent of Loss Angle
Under 30 pF
Refer to detailed speci- B: 2.5% max.(50V, 25V)
Multilayer:
Measuring frequencyD
BD2.5L max.
C、E、FD7L max.
Note 4
(tan d)
: QU400 + 20C
fication
F: 5.0% max. (50V, 25V)
Class1D 1ＭHzM10%fCT1000pFg
1ｋHzM10%fCX1000pFg
30 pF or over : QU1000
C= Nominal capacitance
ꢀ
Class2D 1ｋHzM10%fCT22 Fg
A
120HzM10HzfCX22 Fg
A
Measuring voltageD
ꢀꢀꢀꢀꢀꢀ
Class1D0.5V5VrmsfCT1000pFg
1M0.2VrmsfCX1000pFg
Class2D 1M0.2VrmsfCT22AFg
0.5M0.1VrmsfCX22 Fg
A
Bias application: None
High-Frequency-Multilayer:
Measuring frequency: 1GHz
Measuring equipment: HP4291A
Measuring jig: HP16192A
8.Temperature
(Without
CKD0M250
CHD0M60
RHDK220M60
fppm/Cg
BDM10LfK25V85Cg
J30
BDM10L
According to JIS C 5102 clause 7.12.
Temperature compensating:
Characteristic
voltage
CJD0M120
FD
LfK25V85Cg
K80
ꢀ fK25VJ85Cg
CDM20L
of Capacitance
application)
CHD0M60
BfX7RgDM15L
J22
Measurement of capacitance at 20C and 85C shall be made
to calculate temperature characteristic by the following
equation.
CGD0M30
FfY5VgDꢀꢀL
K82
ꢀ
fK25VJ85Cg
PKDK150M250
PJDK150M120
PHDK150M60
RKDK220M250
RJDK220M120
RHDK220M60
SKDK330M250
SJDK330M120
SHDK330M60
TKDK470M250
TJDK470M120
THDK470M60
UKDK750M250
UJDK750M120
SLD +350 to -1000 (ppm/C)
Appearance:
EDJ20LNK55L
20
(Cꢀ85 - Cꢀ)
ꢀ
fK25VJ85Cg
FDJ30LNK80L
fK25VJ85Cg
6
P 10 ꢀ(ppm/C)
Cꢀ20 P QT ꢀ
ꢀ
High permitivity:
BfX7R、X5Rg：
ꢀꢀM15L
Change of maximum capacitance deviation in step 1 to 5
Temperature at step 1: +20C
CfX5S、X6Sg：
ꢀꢀM22L
Temperature at step 2: minimum operating temperature
Temperature at step 3: +20C (Reference temperature)
Temperature at step 4: maximum operating temperature
Temperature at step 5: +20C
EfY5Ug：
ꢀꢀJ22LNK56L
FfY5Vg：
Reference temperature for X7R, X5R, X5S, X6S, Y5U and Y5V
shall be +25C
ꢀꢀJ22LNK82L
9.Resistance to Flexure of
Substrate
Appearance:
Appearance:
Warp: 1mm
Testing board: glass epoxy-resin substrate
Thickness: 1.6mm (063 TYPE : 0.8mm)
The measurement shall be made with board in the bent position.
No abnormality
Capacitance change:
No abnormality
No abnormality
Capacitance change: Capacitance change:
Within M5% or M0.5 pF, WithinM0.5 pF
B, BJ, C: Within M12.5%
E, F: Within M30%
whichever is larger.
81
2/3
RELIABILITY DATA
Multilayer Ceramic Capacitor Chips
Specified Value
Temperature Compensating (Class 1)
Standard High Frequency Type
Item
High Permittivity (Class 2)
Standard Note1 High Value
Test Methods and Remarks
10.Body Strength
No mechanical dam-
age.
High Frequency Multilayer:
Applied force: 5N
Duration: 10 sec.
4
11.Adhesion of Electrode
No separation or indication of separation of electrode.
Applied force: 5N
（0201 TYPE 2N）
Duration: 30M5 sec.
12.Solderability
At least 95% of terminal electrode is covered by new solder.
Solder temperature: 230M5C
Duration: 4M1 sec.
13.Resistance to soldering
Appearance: No abnor- Appearance: No abnor- Appearance: No abnormality
Preconditioning: Thermal treatment (at 150C for 1 hr)
(Applicable to Class 2.)
mality
mality
Capacitance change: Within M7.5% (B, BJ)
Within M15% (C)
Capacitance change: Capacitance change:
Within M 2.5% or Within M2.5%
M0.25pF, whichever is Q: Initial value
Solder temperature: 270M5C
Duration: 3M0.5 sec.
Within M20% (E, F)
tan d: Initial value
Note 4 Preheating conditions: 80 to 100C, 2 to 5 min. or 5 to 10 min.
150 to 200C, 2 to 5 min. or 5 to 10 min.
larger.
Insulation resistance: Insulation resistance: Initial value
Initial value
Q: Initial value
Withstanding voltage (between terminals): No Recovery: Recovery for the following period under the stan-
Insulation resistance: Withstanding voltage abnormality
Initial value (between terminals): No
dard condition after the test.
24M2 hrs (Class 1)
Withstanding voltage abnormality
(between terminals): No
abnormality
48M4 hrs (Class 2)
14.Thermal shock
Appearance: No abnor- Appearance: No abnor- Appearance: No abnormality
Preconditioning: Thermal treatment (at 150C for 1 hr)
mality
mality
Capacitance change: Within M7.5% (B, BJ)
Within M15% (C)
(Applicable to Class 2.)
Capacitance change: Capacitance change:
Within M 2.5% or Within M0.25pF
M0.25pF, whichever is Q: Initial value
Conditions for 1 cycle:
0
Within M20% (E , F)
Step 1: Minimum operating temperature JK
Step 3: Maximum operating temperatureKJ
Number of cycles: 5 times
C
C
30M3 min.
2 to 3 min.
30M3 min.
2 to 3 min.
3
tan d: Initial value
Note 4 Step 2: Room temperature
0
3
larger.
Insulation resistance: Insulation resistance: Initial value
Initial value
Q: Initial value
Withstanding voltage (between terminals): No Step 4: Room temperature
Insulation resistance: Withstanding voltage abnormality
Initial value (between terminals): No
Recovery after the test: 24M2 hrs (Class 1)
48M4 hrs (Class 2)
Withstanding voltage abnormality
(between terminals): No
abnormality
15.Damp Heat (steady state)
Appearance: No abnor- Appearance: No abnor- Appearance: No abnor- Appearance: No abnor- MultilayerD
mality
mality
mality
mality
Preconditioning: Thermal treatment (at 150C for 1 hr)
(Applicable to Class 2.)
Capacitance change: Capacitance change: Capacitance change:
Capacitance change:
BJ:Within M12.5%
C(X6S) Within M25%
Within M5% or M0.5pF, Within M0.5pF,
B: Within M12.5%
F: Within M30%
tan d: B: 5.0% max.
F: 7.5% max.
Temperature: 40M2C
whichever is larger.
Q:
Insulation resistance:
1000 ME min.
Humidity: 90 to 95% RH
+24
C(X5S),E,F Within M30% Duration: 500 K hrs
0
CU30 pF : QU350
10TC＜30 pF: QU275
+ 2.5C
Note 4
Recovery: Recovery for the following period under the stan-
Note 4
tan d:
dard condition after the removal from test chamber.
24M2 hrs (Class 1)
Insulation resistance: 50 BJ: 5.0% max.
C＜10 pF : QU200 +
10C
ME A F or 1000 ME C, E, F: 11.0% max.
48M4 hrs (Class 2)
whichever is smaller.
Note 5
Insulation resistance:
High-Frequency Multilayer:
C: Nominal capacitance
Insulation resistance:
1000 ME min.
50 MEAF or 1000 ME Temperature: 60M2C
whichever is smaller.
Note 5
Humidity: 90 to 95% RH
+24
Duration: 500 K hrs
0
Recovery: Recovery for the following period under the stan-
dard condition after the removal from test chamber.
24M2 hrs (Class 1)
83
3/3
RELIABILITY DATA
Multilayer Ceramic Capacitor Chips
Specified Value
Temperature Compensating (Class 1)
Item
High Permittivity (Class 2)
Test Methods and Remarks
Standard
High Frequency Type
Standard Note1
High Value
16.Loading under Damp Heat Appearance: No abnor- Appearance: No abnor- Appearance: No abnor- Appearance: No abnor- According to JIS C 5102 Clause 9. 9.
mality
mality
mality
mality
Capacitance change: Preconditioning: Voltage treatment (Class 2)
BJDWithinM12.5L Temperature: 40M2C
Multilayer:
Capacitance change: Capacitance change:
Capacitance change:
Within M 7.5% or CT2 pF: Within M0.4 pF B: Within M12.5%
M0.75pF, whichever is CX2 pF: Within M0.75 F: Within M30%
4
C、E、FDWithinM30L Humidity: 90 to 95% RH
+24
larger.
pF
tan d: B: 5.0% max.
Note 4
tandD
BJD5.0Lmax.
Duration: 500 K hrs
0
Q: CU30 pF: QU200
CD Nominal capaci-
F: 7.5% max.
Applied voltage: Rated voltage
C＜30 pF: QU 100 + tance
10C/3
Note 4
Charge and discharge current: 50mA max. (Class 1,2)
Recovery: Recovery for the following period under the standard
condition after the removal from test chamber.
24M2 hrs (Class 1)
Insulation resistance: Insulation resistance:
C、E、FD11Lmax.
25 MEAF or 500 ME, Insulation resistance:
whichever is the smaller. 25 MEAF or 500 ME,
Note 5 whichever is the smaller.
CD Nominal capaci- 500 ME min.
tance
Insulation resistance:
500 ME min.
48M4 hrs (Class 2)
Note 5
High-Frequency Multilayer:
Temperature: 60M2C
Humidity: 90 to 95% RH
+24
Duration: 500
hrs
0
K
Applied voltage: Rated voltage
Charge and discharge current: 50mA max.
Recovery: 24M2 hrs of recovery under the standard condi-
tion after the removal from test chamber.
17.Loading at High Tempera- Appearance: No abnor- Appearance: No abnor-
According to JIS C 5102 clause 9.10.
ture
mality
mality
Appearance: No abnor- Appearance: No abnormality Multilayer:
Capacitance change:
Within M3% or
M0.3pF, whichever is
larger.
Capacitance change:
Within M3% or
M0.3pF, whichever is
larger.
mality
Capacitance change:
BJDWithinM12.5L
WithinM20LFF
Preconditioning: Voltage treatment (Class 2)
Capacitance change:
B: Within M12.5%
F: Within M30%
Note 4
Temperature:125M3CfClass 1, Class 2: B, BJfX7Rgg
85M2C (Class 2: BJ,F)
+48
0
WithinM25LFF Duration: 1000 K hrs
Q: CU30 pF : QU350
Insulation resistance:
CDWithinM25L(X6S) Applied voltage: Rated voltageP2 Note 6
10TC＜30 pF: QU275 1000 ME min.
+ 2.5C
tan d:
WithinM30L(X5S) Recovery: Recovery for the following period under the stan-
B: 4.0% max.
E、FDWithinM30L
Note 4
dard condition after the removal from test chamber.
As for Ni product, thermal treatment shall be performed
prior to the recovery.
C＜10 pF: QU200 +
10C
F: 7.5% max.
Insulation resistance:
50 MEAF or 1000 ME,
whichever is smaller.
tandD
CD Nominal
BJD5.0Lmax.
C、F、FD11Lmax.
24M2 hrs (Class 1)
capacitance
48M4 hrs (Class 2)
Insulation resistance:
1000 ME min.
Note 5 Insulation resistance: High-Frequency Multilayer:
50 MEAF or 1000 ME, Temperature: 125M3C (Class 1)
+48
whichever is smaller.
Note 5
Duration: 1000 K hrs
0
Applied voltage: Rated voltageP2
Recovery: 24M2 hrs of recovery under the standard condi-
tion after the removal from test chamber.
Note 1
Note 2
Note 3
:For 105 type, specified in "High value".
:Thermal treatment (Multilayer): 1 hr of thermal treatment at 150 J0 /K10 C followed by 48M4 hrs of recovery under the standard condition shall be performed before the measurement.
Voltage treatment (Multilayer): 1 hr of voltage treatment under the specified temperature and voltage for testing followed by 48M4 hrs of recovery under the standard condition shall be performed before the measurement.
:
Note 4, 5 :The figure indicates typical inspection. Please refer to individual specifications.
Note 6 :Some of the parts are applicable in rated voltageP1.5. Please refer to individual specifications.
Note on standard condition: "standard condition" referred to herein is defined as follows: 5 to 35C of temperature, 45 to 85% relative humidity, and 86 to 106kPa of air pressure.
When there are questions concerning measurement results: In order to provide correlation data, the test shall be conducted under condition of 20M2C of temperature, 60 to 70% relative humidity,
and 86 to 106kPa of air pressure. Unless otherwise specified, all the tests are conducted under the "standard condition."
85
1/6
PRECAUTIONS
Precautions on the use of Multilayer Ceramic Capacitors
Stages
Precautions
Technical considerations
1.Circuit Design
Verification of operating environment, electrical rating and per-
formance
1. A malfunction in medical equipment, spacecraft, nuclear re-
actors, etc. may cause serious harm to human life or have
severe social ramifications. As such, any capacitors to be
used in such equipment may require higher safety and/or reli-
ability considerations and should be clearly differentiated from
components used in general purpose applications.
4
Operating Voltage (Verification of Rated voltage)
1. The operating voltage for capacitors must always be lower
than their rated values.
If an AC voltage is loaded on a DC voltage, the sum of the two
peak voltages should be lower than the rated value of the ca-
pacitor chosen. For a circuit where both an AC and a pulse
voltage may be present, the sum of their peak voltages should
also be lower than the capacitor's rated voltage.
2. Even if the applied voltage is lower than the rated value, the
reliability of capacitors might be reduced if either a high fre-
quency AC voltage or a pulse voltage having rapid rise time is
present in the circuit.
1.The following diagrams and tables show some examples of recommended patterns to
prevent excessive solder amourts.flarger fillets which extend above the component end
terminationsg
2.PCB Design
Pattern configurations
(Design of Land-patterns)
1. When capacitors are mounted on a PCB, the amount of sol-
der used (size of fillet) can directly affect capacitor performance.
Therefore, the following items must be carefully considered in
the design of solder land patterns:
Examples of improper pattern designs are also shown.
(1) Recommended land dimensions for a typical chip capacitor land patterns for PCBs
(1) The amount of solder applied can affect the ability of chips
to withstand mechanical stresses which may lead to break-
ing or cracking. Therefore, when designing land-patterns
it is necessary to consider the appropriate size and con-
figuration of the solder pads which in turn determines the
amount of solder necessary to form the fillets.
(2) When more than one part is jointly soldered onto the same
land or pad, the pad must be designed so that each
component's soldering point is separated by solder-re-
sist.
Recommended land dimensions for wave-soldering (unit: mm)
Type
107
1.6
0.8
212
2.0
316
3.2
1.6
325
3.2
2.5
L
Size
W
51.25
A
B
0.8V1.0 1.0V1.4 1.8V2.5 1.8V2.5
0.5V0.8 0.8V1.5 0.8V1.7 0.8V1.7
0.6V0.8 0.9V1.2 1.2V1.6 1.8V2.5
C
Recommended land dimensions for reflow-soldering (unit: mm)
Type
063
0.6
0.3
105
1.0
0.5
107
1.6
0.8
212
2.0
316
3.2
1.6
325
3.2
2.5
432
4.5
3.2
L
Size
W
51.25
A
0.20V0.30 0.45V0.55 0.6V0.8 0.8V1.2 1.8V2.5 1.8V2.5 2.5V3.5
0.20V0.30 0.40V0.50 0.6V0.8 0.8V1.2 1.0V1.5 1.0V1.5 1.5V1.8
0.25V0.40 0.45V0.55 0.6V0.8 0.9V1.6 1.2V2.0 1.8V3.2 2.3V3.5
B
C
Excess solder can affect the ability of chips to withstand mechanical stresses. Therefore,
please take proper precautions when designing land-patterns.
Type
L
316（4 circuits） 212（4 circuits）
3.2
1.6
2.0
1.25
W
a
0.7V0.9
1
0.5V0.6
0.5V0.6
0.2V0.3
0.5
b
c
0.4V0.5
0.8
d
Type
L
212（2 circuits） 110（2 circuits）
2.0
1.37
1.0
1.25
W
a
0.5V0.6
0.5V0.6
0.5V0.6
1.0
0.35V0.45
0.55V0.65
0.3V0.4
0.64
b
c
d
87
2/6
PRECAUTIONS
Precautions on the use of Multilayer Ceramic Capacitors
Stages
Precautions
Technical considerations
2.PCB Design
(2) Examples of good and bad solder application
Not recommended
Recommended
Items
Mixed mounting
of SMD and
leaded
4
components
Component
placement close
to the chassis
Hand-soldering
of leaded
components
near mounted
components
Horizontal
component
placement
Pattern configurations
1-1. The following are examples of good and bad capacitor layout; SMD capacitors should be
located to minimize any possible mechanical stresses from board warp or deflection.
(Capacitor layout on panelized [breakaway] PC boards)
1. After capacitors have been mounted on the boards, chips can
be subjected to mechanical stresses in subsequent manufac-
turing processes (PCB cutting, board inspection, mounting of
additional parts, assembly into the chassis, wave soldering
the reflow soldered boards etc.) For this reason, planning
pattern configurations and the position of SMD capacitors
should be carefully performed to minimize stress.
Not recommended
Recommended
Deflection of
the board
1-2. To layout the capacitors for the breakaway PC board, it should be noted that the amount
of mechanical stresses given will vary depending on capacitor layout. The example
below shows recommendations for better design.
1-3. When breaking PC boards along their perforations, the amount of mechanical stress on
the capacitors can vary according to the method used. The following methods are
listed in order from least stressful to most stressful: push-back, slit, V-grooving, and
perforation. Thus, any ideal SMD capacitor layout must also consider the PCB splitting
procedure.
89
3/6
PRECAUTIONS
Precautions on the use of Multilayer Ceramic Capacitors
Stages
Precautions
Technical considerations
3.Considerations for auto-
matic placement
Adjustment of mounting machine
1. If the lower limit of the pick-up nozzle is low, too much force may be imposed on the
capacitors, causing damage. To avoid this, the following points should be considered
before lowering the pick-up nozzle:
1. Excessive impact load should not be imposed on the capaci-
tors when mounting onto the PC boards.
2. The maintenance and inspection of the mounters should be
conducted periodically.
(1)The lower limit of the pick-up nozzle should be adjusted to the surface level of the PC
board after correcting for deflection of the board.
4
(2)The pick-up pressure should be adjusted between 1 and 3 N static loads.
(3)To reduce the amount of deflection of the board caused by impact of the pick-up nozzle,
supporting pins or back-up pins should be used under the PC board. The following dia-
grams show some typical examples of good pick-up nozzle placement:
Not recommended
Recommended
Single-sided
mounting
Double-sided
mounting
2. As the alignment pin wears out, adjustment of the nozzle height can cause chipping or
cracking of the capacitors because of mechanical impact on the capacitors. To avoid
this, the monitoring of the width between the alignment pin in the stopped position, and
maintenance, inspection and replacement of the pin should be conducted periodically.
Selection of Adhesives
1. Some adhesives may cause reduced insulation resistance. The difference between the
shrinkage percentage of the adhesive and that of the capacitors may result in stresses
on the capacitors and lead to cracking. Moreover, too little or too much adhesive applied
to the board may adversely affect component placement, so the following precautions
should be noted in the application of adhesives.
1. Mounting capacitors with adhesives in preliminary assembly,
before the soldering stage, may lead to degraded capacitor
characteristics unless the following factors are appropriately
checked; the size of land patterns, type of adhesive, amount
applied, hardening temperature and hardening period. There-
fore, it is imperative to consult the manufacturer of the adhe-
sives on proper usage and amounts of adhesive to use.
(1)Required adhesive characteristics
a. The adhesive should be strong enough to hold parts on the board during the mounting &
solder process.
b. The adhesive should have sufficient strength at high temperatures.
c. The adhesive should have good coating and thickness consistency.
d. The adhesive should be used during its prescribed shelf life.
e. The adhesive should harden rapidly
f. The adhesive must not be contaminated.
g. The adhesive should have excellent insulation characteristics.
h. The adhesive should not be toxic and have no emission of toxic gasses.
(2)The recommended amount of adhesives is as follows;
Figure
212/316 case sizes as examples
0.3mm min
a
b
c
100 V120 Am
Adhesives should not contact the pad
91
4/6
PRECAUTIONS
Precautions on the use of Multilayer Ceramic Capacitors
Stages
Precautions
Technical considerations
Selection of Flux
1-1. When too much halogenated substance (Chlorine, etc.) content is used to activate the
flux, or highly acidic flux is used, an excessive amount of residue after soldering may
lead to corrosion of the terminal electrodes or degradation of insulation resistance on
the surface of the capacitors.
4. Soldering
1. Since flux may have a significant effect on the performance of
capacitors, it is necessary to verify the following conditions
prior to use;
(1)Flux used should be with less than or equal to 0.1 wt%
(equivelent to chroline) of halogenated content. Flux hav-
ing a strong acidity content should not be applied.
(2)When soldering capacitors on the board, the amount of
flux applied should be controlled at the optimum level.
(3)When using water-soluble flux, special care should be taken
to properly clean the boards.
1-2. Flux is used to increase solderability in flow soldering, but if too much is applied, a large
amount of flux gas may be emitted and may detrimentally affect solderability. To mini-
mize the amount of flux applied, it is recommended to use a flux-bubbling system.
1-3. Since the residue of water-soluble flux is easily dissolved by water content in the air, the
residue on the surface of capacitors in high humidity conditions may cause a degrada-
tion of insulation resistance and therefore affect the reliability of the components. The
cleaning methods and the capability of the machines used should also be considered
carefully when selecting water-soluble flux.
4
Soldering
1-1. Preheating when soldering
Temperature, time, amount of solder, etc. are specified in accor-
dance with the following recommended conditions.
Heating: Ceramic chip components should be preheated to within 100 to 130C of the sol-
dering.
Cooling: The temperature difference between the components and cleaning process should
not be greater than 100C.
Ceramic chip capacitors are susceptible to thermal shock when exposed to rapid or concen-
trated heating or rapid cooling. Therefore, the soldering process must be conducted with
great care so as to prevent malfunction of the components due to excessive thermal shock.
Recommended conditions for soldering
[Reflow soldering]
And please contact us about peak temperature when you use
lead-free paste.
Temperature profile
TemperaturefCg
300
Peak 260C max
10 sec max
200
Gradually
cooling
Preheating
100
150C
Heating above 230C
60 sec min
40 sec max
0
※Ceramic chip components should be preheated to
within 100 to 130C of the soldering.
※Assured to be reflow soldering for 2 times.
Caution
1. The ideal condition is to have solder mass (fillet) controlled to 1/2 to 1/3 of the thick-
ness of the capacitor, as shown below:
Capacitor
Solder
PC board
2. Because excessive dwell times can detrimentally affect solderability, soldering dura-
tion should be kept as close to recommended times as possible.
[Wave soldering]
Temperature profile
TemperaturefCg
300
Peak 260C max
10 sec max
200
Gradually
cooling
Preheating
150C
100
120 sec min
0
※Ceramic chip components should be preheated to
within 100 to 130C of the soldering.
※Assured to be wave soldering for 1 time.
※Except for reflow soldering type.
Caution
1. Make sure the capacitors are preheated sufficiently.
2. The temperature difference between the capacitor and melted solder should not be
greater than 100 to 130C
3. Cooling after soldering should be as gradual as possible.
4. Wave soldering must not be applied to the capacitors designated as for reflow solder-
ing only.
93
5/6
PRECAUTIONS
Precautions on the use of Multilayer Ceramic Capacitors
Stages
Precautions
Technical considerations
[Hand soldering]
4. Soldering
ꢀTemperature profile
TemperaturefCg
400
300
200
350C max
3 sec max
Gradually
cooling
⊿Ｔ�
4
100
0
60 sec min
f※⊿ＴT190C f3216Type maxg, ⊿ＴT130C f3225
Type mingg
※It is recommended to use 20W soldering iron and
the tip is 1B or less.
※The soldering iron should not directly touch the
components.
※Assured to be soldering iron for 1 time.
Note: The above profiles are the maximum allowable
soldering condition, therefore these profiles are
not always recommended.
Caution
1. Use a 20W soldering iron with a maximum tip diameter of 1.0 mm.
2. The soldering iron should not directly touch the capacitor.
5.Cleaning
Cleaning conditions
1. The use of inappropriate solutions can cause foreign substances such as flux residue to
adhere to the capacitor or deteriorate the capacitor's outer coating, resulting in a degra-
dation of the capacitor's electrical properties (especially insulation resistance).
2. Inappropriate cleaning conditions (insufficient or excessive cleaning) may detrimentally
affect the performance of the capacitors.
1. When cleaning the PC board after the capacitors are all
mounted, select the appropriate cleaning solution according
to the type of flux used and purpose of the cleaning (e.g. to
remove soldering flux or other materials from the production
process.)
2. Cleaning conditions should be determined after verifying,
through a test run, that the cleaning process does not affect
the capacitor's characteristics.
(1)Excessive cleaning
In the case of ultrasonic cleaning, too much power output can cause excessive vibration of
the PC board which may lead to the cracking of the capacitor or the soldered portion, or
decrease the terminal electrodes' strength. Thus the following conditions should be
carefully checked;
Ultrasonic output
Below 20 W/b
Ultrasonic frequency
Below 40 kHz
Ultrasonic washing period 5 min. or less
6.Post cleaning processes
1. With some type of resins a decomposition gas or chemical
reaction vapor may remain inside the resin during the harden-
ing period or while left under normal storage conditions result-
ing in the deterioration of the capacitor's performance.
2. When a resin's hardening temperature is higher than the
capacitor's operating temperature, the stresses generated by
the excess heat may lead to capacitor damage or destruction.
The use of such resins, molding materials etc. is not recom-
mended.
Breakaway PC boards (splitting along perforations)
1. When splitting the PC board after mounting capacitors and
other components, care is required so as not to give any
stresses of deflection or twisting to the board.
7.Handling
2. Board separation should not be done manually, but by using
the appropriate devices.
Mechanical considerations
1. Be careful not to subject the capacitors to excessive mechani-
cal shocks.
(1)If ceramic capacitors are dropped onto the floor or a hard
surface, they should not be used.
(2)When handling the mounted boards, be careful that the
mounted components do not come in contact with or bump
against other boards or components.
95
6/6
PRECAUTIONS
Precautions on the use of Multilayer Ceramic Capacitors
Stages
Precautions
Technical considerations
8.Storage conditions
Storage
1. If the parts are stored in a high temperature and humidity environment, problems such
as reduced solderability caused by oxidation of terminal electrodes and deterioration of
taping/packaging materials may take place. For this reason, components should be used
within 6 months from the time of delivery. If exceeding the above period, please check
solderability before using the capacitors.
1. To maintain the solderability of terminal electrodes and to keep
the packaging material in good condition, care must be taken
to control temperature and humidity in the storage area. Hu-
midity should especially be kept as low as possible.
YRecommended conditions
4
Ambient temperature
Humidity
Below 40C
Below 70% RH
The ambient temperature must be kept below 30C. Even un-
der ideal storage conditions capacitor electrode solderability
decreases as time passes, so should be used within 6 months
from the time of delivery.
YCeramic chip capacitors should be kept where no chlorine or
sulfur exists in the air.
2. The capacitance value of high dielectric constant capacitors
(type 2 &3) will gradually decrease with the passage of time,
so this should be taken into consideration in the circuit design.
If such a capacitance reduction occurs, a heat treatment of
150C for 1hour will return the capacitance to its initial level.
97
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